Printed circuitry for magnetic core matrix



May 12, 1964 G. J. DAVID PRINTED CIRCUITRY FOR MAGNETIC CORE MATRIXFiled- Aug. 24, 1960 FIG 2 FlG.1

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George J. David United States Patent 3,133,270 PRINTED CIRCUITRY FORMAGNETE CORE MATRIX George J. David, Chicago, 111., assignor toAutomatic Electric Laboratories, Inc., Northlake, 11]., a corporation ofDelaware Filed Aug. 24, 1960, Ser. No. 51,746 4 Claims. (Cl. 340-174)This invention relates to a memory core device and more particularly, toa printed circuit arrangement for a memory core matrix.

The primary object of this invention is to provide a printed circuitarrangement for a memory core device which requires a minimum number ofsoldered connections to complete the winding through the magnetic cores.

The invention is an improvement over the copending "applicaton assignedto the present assignee and entitled,

Method of Producing a Memory Core Array, filed by K. W. Liston and R. K.Stoehr on August 24, 1960, US. Serial No. 51,688. This copendingapplication discloses a method whereby solder coated printed conductorsdisposed on sheets or cards made of insulating material are gapped orinterrupted at each of an array of cutouts. The gaps are bridged bycorresponding conductors disposed on an adajcent card which overlap thetwo conductor ends formed by the gap. Continuity of the conductors ismade after the two overlapped conductor areas at each cutout aresoldered together.

The present invention improves upon the aforedescribed disclosure bysubstantially reducing, for example by onehalf, the number of solderedconnections required to complete the windings through the cores. Insteadof bridging each gap formed between an edge of a lip and an edge of thecutout with a relatively short conductor disposed on an adjacent sheet,continuity is insured by forming conductors, each extending all the wayfrom one cutout to the next, alternately on adjacent sheets so that bothends of each of these conductors overlaps a similar conductor on theadjacent sheet. Thus there is only one overlap between adjacentconductors at each cutout and hence only one solder connection isrequired at each cutout instead of the two connections in the case ofthe copending application.

Other objects and features of my invention will become apparent from aperusal of the following detailed description taken in conjunction withthe following drawing of which:

FIGURE 1 is a schematic view showing the winding arrangement through thepositioned memory cores.

FIGURE 2 is a plan view showing the cards before they are moved withrespect to each other, that is, before the lips thereof are insertedinto the cores.

FIGURE 3 is an exploded cross-sectional view of the assembly accordingto the invention including the temporary core jig or core support andthe posts used to press the cards together.

FIGURE 4 is a plan view showing a magnetic ring core held by means of alip which extends at a cutout of the card.

FIGURES 5A and 5B are plan views of two cards having printed conductorsdisposed thereon and extending lips formed at a plurality of cutouts.

Referring now to the drawings, FIGURE 1 shows a winding arrangement forthe magnetic memory device. In particular the arrangement comprises asense winding 14, a horizontal winding 16 and a vertical Winding 15, allof which thread, that is extend through, the array of cores 12.

The method of assembling the core matrix which is also used in thecopending application will be first described. Referring now to FIGURES2, 3 and 4, the

3,1332% Patented May 12, 1964 cores 12 are set on end in circulardepressions of a jig 23. Cards 10 are then aligned with and laid overthe positioned cores so as to be at right angles therewith. This isfollowed by moving the adjacent cards 10 with respect to each other sothat the lips 13 of each card, which extend in opposite directions, areinserted through the core apertures and overlap each other outside ofthe core apertures. The thusly assembled cards are then placed underposts 24, shown in FIG. 4. Posts 24 are the means used to exert pressureupon the sheets 14 and act directly over the overlapped area so as togive maximum effect. Heat is applied simultaneously with the pressurecausing thereby the solder disposed on the overlapped portion of theadjacent conductors to flow together and form con tinuous conductingpaths. This heat is radiated through the sheets by means of a heatingelement which may be an integral part of the post 24 or separatetherefrom. After the pressure and heat is removed the assembly is selfsupporting and does not require any additional mechanical support.

More specifically the device which is assembled by the aforedescribedmethod comprises cards 10 each having printed conductor segments 11disposed on at least one of its surfaces, and toroidal shape cores 12.Cards 10 have cutouts 20 arranged to correspond with the arrangement ofthe cores 12. Extending from each of these cutouts is an extending lip13 which is the means used to hold and carry conductors 11 through thecore 12. The conductors 11 are printed on the cards 11 by any of thetechniques commonly used in the art of printed circuitry. Furthermore,each of the conductors of one card extends over the lips 13 and betweena given pair of cutouts. The conductors on adjacent cards also extendover the lips 13 but between alternate pairs of cutouts as more clearlyshown in FIGS. 5A and 5B. In this manner the conductors of one cardmatches or completes the conductors of another card, thereby formingcontinuous electrical paths through the cores.

The cores 12 in addition to being held by the lips 13 are locked intoposition thereby by virtue of the fact that the lips of one sheet extendthrough the cores from one direction and the lips of an adjacent sheetfrom the opposite direction. Thus, no specific means is required tofasten down the cores 12 to the cards 10 or vice versa.

My invention has been described in detail, however, it is understoodthat the present disclosure has been made only by way of example andnumerous changes in the detail and structure may be made withoutdeparting from the scope of my invention as hereinafter claimed.

What is claimed is:

1. A printed circuit arrangement for a memory core matrix comprising; anarray of ring cores, a pluality of substantially flat sheets made ofinsulating material and having cutouts through which said ring coresextend in planes perpendicular to planes of the sheets, at least one ofsaid sheets having lips extending from one side of said cutouts andprotruding through said ring cores, a plurality of printed conductorsegments disposed on at least one surface of said sheets over said lipsand extending between alternate pairs of said cutouts, said conductorsegments on one sheet being continued by other segments disposed on anopposite surface of an adjacent sheet thereby forming a continuousconducting path between and through said ring cores.

2. A printed circuit arrangement for a memory core matrix, as claimed inclaim 1, wherein said lips of one sheet extend oppositely to lips ofanother of said sheets lying in a parallel plane so that the said ringcores are locked in position.

3. A printed circuit arrangement for a memory core matrix, as claimed inclaim 2, wherein in the assembled condition of said matrix said lips ofone sheet are overlapped by lips of an adjacent sheet outside of saidring cores.

4. A printed circuit arrangement for a memory core matrix comprising; anarray of ring cores, a stack of sub- -3 between alternate pairs of saidapertures, said conductor segments on one member being continued byother segments disposed on an opposite surface of an adjacent memberthereby forming a continuous conducting path stantially fiat membersmade of insulating material and 5 between and through said g Coreshavingspaced apertures through which said ring cores extend in planesperpendicular to planes of the said members, at least one of saidmembers have one or more portions extending through said ring cores, aplurality of printed conductor segments disposed on at least one surfaceof said members over said portions and extending References Cited in thefile of this patent UNITED STATES PATENTS 2,901,736 Sylvester Aug. 29,1959 2,910,675 Gessner Get. 27, 1959 2,970,296 Horton Jan. 31, 1961

1. A PRINTED CIRCUIT ARRANGEMENT FOR A MEMORY CORE MATRIX COMPRISING;;AN ARRAY OF RNG CORES, A PLUALITY OF SUBSTANTIALLY FLAT SHEETS MADE OFINSULATING MATERIAL AND HAVING CUTOUTS THROUGH WHICH SAID RING CORESEXTEND IN PLANES PERPENDICULAR TO PLANES OF THE SHEETS, AT LEAST ONE OFSAID SHEETS HAVING LIPS EXTENDING FROM ONE SIDE OF SAID CUTOUTS ANDPROTRUDING THROUGH SAID RING CORES, A PLURALTIY OF PRINTED CONDUCTORSEGMENTS DISPOSED ON AT LEAST ONE SURFACE OF SAID SHEETS OVER SAIDLIPSAND EXTENDING BETWEEN ALTERNATE PAIRS OF SAID CUTOUTS, SAID CONDUCTORSEGMENTS ON ONE SHEET BEING CONTINUED BY OTHER SEGMENTS DISPOSED ON ANOPPOSITE SURFACE OF AN ADJCENT SHEET THEREBY FORMING A CONTINUOUSCONDUCTING PATH BETWEEN AND THROUGH SAID RING CORES.